Journal of Microelectronics and Electronic PackagingJournal EI
刊物类型:Journal
ISSN:15514897
EISSN:-
出版商:IMAPS-International Microelectronics and Packaging Society
国家:United States
学科1:Computer Networks and Communications
学科2:Electrical and Electronic Engineering
学科3:Electronic, Optical and Magnetic Materials
是否开放:-