Ieee Transactions On Device And Materials Reliability

The scope of the publication includes, but is not limited to Reliability of: Devices, Materials, Processes, Interfaces, Integrated Microsystems (including MEMS & Sensors), Transistors, Technology (CMOS, BiCMOS, etc.), Integrated Circuits (IC, SSI, MSI, LSI, ULSI, ELSI, etc.), Thin Film Transistor Applications. The measurement and understanding of the reliability of such entities at each phase, from the concept stage through research and development and into manufacturing scale-up, provides the overall database on the reliability of the devices, materials, processes, package and other necessities for the successful introduction of a product to market. This reliability database is the foundation for a quality product, which meets customer expectation. A product so developed has high reliability. High quality will be achieved because product weaknesses will have been found (root cause analysis) and designed out of the final product. This process of ever increasing reliability and quality will result in a superior product. In the end, reliability and quality are not one thing; but in a sense everything, which can be or has to be done to guarantee that the product successfully performs in the field under customer conditions. Our goal is to capture these advances. An additional objective is to focus cross fertilized communication in the state of the art of reliability of electronic materials and devices and provide fundamental understanding of basic phenomena that affect reliability. In addition, the publication is a forum for interdisciplinary studies on reliability. An overall goal is to provide leading edge/state of the art information, which is critically relevant to the creation of reliable products.

中文简介Magazine introduction

本出版物的范围包括但不限于以下方面的可靠性：设备、材料、工艺、接口、集成微系统（包括 MEMS 和传感器）、晶体管、技术（CMOS、BiCMOS 等）、集成电路（ IC、SSI、MSI、LSI、ULSI、ELSI 等），薄膜晶体管应用。从概念阶段到研发再到制造放大的每个阶段对这些实体的可靠性进行测量和理解，为设备、材料、工艺、封装和其他必需品的可靠性提供了整体数据库。将产品成功推向市场。该可靠性数据库是满足客户期望的优质产品的基础。如此开发的产品具有高可靠性。将实现高质量，因为将发现产品弱点（根本原因分析）并根据最终产品进行设计。这种不断提高可靠性和质量的过程将产生卓越的产品。最后，可靠性和质量不是一回事。但从某种意义上说，可以或必须做的一切都是为了保证产品在客户条件下在现场成功运行。我们的目标是抓住这些进步。另一个目标是在电子材料和设备的可靠性领域集中交叉交流，并提供对影响可靠性的基本现象的基本理解。此外，该出版物是可靠性跨学科研究的论坛。总体目标是提供最前沿/最先进的信息，这与创建可靠的产品至关重要。

期刊简述Magazine introduction

Ieee Transactions On Device And Materials Reliability创刊于2001年，由IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC出版商出版，收稿方向涵盖工程技术 - 工程：电子与电气全领域，此刊是中等级别的SCI期刊，所以过审相对来讲不是特别难，但是该刊专业认可度不错，仍然是一本值得选择的SCI期刊。平均审稿速度较慢,6-12周，影响因子指数2.000，该期刊近期没有被列入国际期刊预警名单，广大学者值得一试。

中科院分区Magazine introduction

大类学科	小类学科	分区	Top期刊	综述期刊
工程技术	PHYSICS, APPLIED 物理：应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气	3区	是	是

名词解释：
中科院分区也叫中科院JCR分区，基础版分为13个大类学科，然后按照各类期刊影响因子分别将每个类别分为四个区，影响因子5%为1区，6%-20%为2区，21%-50%为3区，其余为4区。

JCR分区Magazine introduction

大类学科	小类学科	分区
工程技术	PHYSICS, APPLIED 物理：应用 ENGINEERING, ELECTRICAL & ELECTRONIC 工程：电子与电气	3区

名词解释：
JCR没有设置大类，只分为176个具体学科，按当期（1年）的影响因子进行分区；JCR是按照“平均主义”思想，根据刊物IF的高至低平均划分4个区，每个区含有该领域总量25%的期刊。中科院的分区如同社会阶层的金字塔结构，1区只有5%的顶级期刊， 2~4区期刊数量也逐层增加,所以中科院的1区和2区杂志很少，杂志质量相对也高，基本都是本领域的顶级期刊。

期刊名称	领域	中科院分区	影响因子
Siam-asa Journal On Uncertainty Quantification	工程技术	3区	2.000
Flexible Services And Manufacturing Journal	工程技术	3区	2.700
Navigation-journal Of The Institute Of Navigation	工程技术	3区	2.200
Ieee Transactions On Device And Materials Reliability	工程技术	3区	2.000
Ieee Electrical Insulation Magazine	工程技术	3区	2.900
Chembioeng Reviews	工程技术	3区	4.800